HSD460I

Transcend's HSD460I semi-thin SSD is built with 112 layers of 3D NAND flash and 6Gb/s SATA III interface, delivering never-before-seen transfer speeds. Applied with Corner Bond technology and anti-sulfur resistance, the HSD460I is ruggedized to withstand demanding industrial applications. Following JEDEC's MO-297 standard, the HSD460I is fully tested internally and is capable of operating in a wide range of operating temperatures ranging from -40 ℃ ~ 85 ℃, ideal for read-intensive applications and mobile devices with limited space, such as industrial control systems. The device can also be used in medical equipment, mobile devices and POS terminals.

112-layer 3D NAND Flash

Corner Bond

Extended Temperature

Dynamic Speed Limit Adjustment

Alteration in Reading Data

Anti-Sulfur Technology

Rubbish Collection

Wear levelling

TRIM

Faulty Block Management

Power Shield

Early Move

Features

Firmware features

  • Dynamic thermal throttling
  • LDPC ECC (Error Correction Code) function Integrated
  • Advanced Global Wear Leveling and Defective Block Management for Reliability
  • Advanced Garbage Collection
  • Static Data Refresh
  • Enhanced S.M.A.R.T. function for durability
  • TRIM command for better performance
  • NCQ command for better performance
  • Encryption of entire disk with Advanced Encryption Standard (AES) (optional)
  • DevSleep power-saving mode (Optional)

Hardware features

  • Complies with RoHS 2.0 standards
  • Complies with JEDEC MO-297
  • Endurance: 3K cycles P/E (Program/Delete) guaranteed
  • The main components are factory reinforced with Corner Bond technology.
  • Implemented anti-sulfur technology to prevent sulfidation in the environment.
  • Power Shield (PS) to ensure data transfer integrity and minimise data corruption in the drive during an abnormal power outage
  • Promised operational reliability over a wide temperature range (from -40 ℃ to 85 ℃)

Specifications

Appearance
Dimensions 54 mm x 39.8 mm x 4 mm (2.13″ x 1.57″ x 0.15″)
Weight 9 g (0.32 oz)
Form Factor
  • Half-slim (MO-297)

Interface
Bus Interface
  • SATA III 6Gb/s

Storage
Capacity
  • 64 GB/
  • 128 GB/
  • 256 GB/
  • 512 GB/
  • 1 TB/
  • 2 TB
Flash Type
  • 112-layer 3D NAND flash

Operating Environment
Operating Voltage
  • 5V±5%
Operating Temperature
  • Wide temperature

    -40°C (-40°F) ~ 85°C (185°F)
Storage Temperature -55°C (-67°F) ~ 85°C (185°F)
Humidity 5% ~ 95%
Hit
  • 1500 G, 0.5 ms, 3 axes
Vibration (Operating) 20 G (Peak-to-Peak), 7 Hz ~ 2,000 Hz (frequency)

Feeding
Power consumption (Operating) 1.9 watt(s)
Energy consumption (IDLE) 0.3 watt(s)

Performance
Sequential Read / Write (CrystalDiskMark) Read: Up to 560 MB/s
Write: Up to 490 MB/s
4K Random Read / Write (IOmeter) Read: Up to 30,000 IOPS
Write: Up to 80,000 IOPS
Mean Time Between Failures (MTBF) 3,000,000 hour(s)
Terabytes Written (TBW) Up to 245 TBW
Number of Discs Written Per Day (DWPD) 1.75 (3 years)
Note
  • Speed may vary due to host, hardware, software, usage and storage capacity.
  • The workload used to rate DWPD may be different compared to your actual workload, due to the difference in hardware, software, usage and storage capacity of the host.
  • Terabytes Written (TBW) indicates the resistance under the highest capacity.

Warranty
Certificate
  • CE/
  • UKCA/
  • FCC/
  • BSMI
Warranty
  • Three-Year Limited Warranty

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