Tempel Group as Premium Partner of the brand Transcend since 2002 and a leading distributor of electronic components, is committed to the 5th generation of 3D NAND Flash.
A small revolution is taking place in the electronic storage sector: the emergence of 3D NAND technology.
This mainly means a considerable increase in the storage capacity of these devices. 3D NAND technology is not a new technology; 3D NAND has been manufactured for some years now, especially in consumer products. As technology has advanced and the level of reliability has increased, Transcend's R&D team has developed solutions that meet the industry standard. Now Transcend, a global brand developer of storage solutions, has launched the fifth generation of this 3D NAND Flash memory to achieve a higher level of reliability.
3D NAND BiCS5, the REvolution of 3D NAND Technology
Transcend recently unveiled the brand's most innovative industrial storage solution: BiCS5 3D NAND flash. This new evolution in 3D NAND technology involves higher storage density, moving from 96 to 112 layers of vertically stacked memory cells in a three-bit-per-cell (TLC) architecture and with more cells placed horizontally on a chip.
As a result, devices with 3D NAND BiCS5 technology increase the storage capacity per wafer by 50% compared to the previous generation. Transcend is committed to continuing to innovate year after year through this technology, especially when new systems that offer higher speeds for 5G applications, automotive devices, IoT and Cloud Computing are in demand. These systems are demanding more power and storage capacity every year, and 3D NAND BiCS5 technology is the perfect fit.
Transcend solutions with BiCS5 technology
As an industry leader, Transcend now introduces two 3D TLC flash storage solutions with up to 112 layers (BiCS5). The SSD470K with SATA III 2.5" form factor and the PCIe Gen 4×4 MTE710T & MTE710T-I. Development continues for new solutions in SD cards, microSD, SATAIII M.2, mSATA...
The new generation of this technology is the BiCS5, which has more storage capacity reaching up to 4 Tb of capacity, thus providing a lower cost per bit.
Added value of Transcend's BiCS5 technology.
- Extended operating temperature: Tests carried out in temperature chambers ensure correct operation in environments of -20°C ~ 75°C.
- Dynamic temperature control: The controller adjusts the transfer rate depending on the temperature of the disk, thus avoiding overheating and increasing disk life and data reliability.
- Corner-Bond: Application of encapsulant around the main chips that protects against thermal stress and vibration, offering increased long-term durability of the disc.
- 30μ" PCB Gold Fingers: This feature provides increased conductivity and protection against oxidation on the connection pins, suitable for military applications, surveillance systems, factory automation and transportation, where durability is a must.
- Control Center: The SaaS solution created for all Transcend storage devices allows users to connect, monitor and manage these devices both on their local network and externally.
- Fixed BOM: Control of the list of product components ensuring 100% compatibility with the customer's equipment throughout the life cycle of the device.
Transcend has thus succeeded in bringing to the market a new range of high-capacity flash drives, which are very attractive for companies that demand this type of solution at a competitive price.
About Tempel Group:
Tempel Group is a company created in Barcelona that has developed its activity through four business areas: Health, Energy, Engineering and Consumer, and currently has offices in more than 11 Spanish and Portuguese-speaking countries. It has commercial activity in more than 20 countries and its own offices in 17 cities.
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